At present, the Chinese market is the most widely used laser marking machine type: fibre laser marking machine, ultraviolet laser marking machine, carbon dioxide laser marking machine, picosecond laser marking machine, femtosecond laser marking machine, but fibre optic, ultraviolet, carbon dioxide laser marking machine of these three types is the mainstream of the market for the laser marking equipment, almost covering all types of product marking packaging applications, they apply the difference is they in their respective fields of development advantages, the main difference is also the working principle and its core components of different structures, Tianzheng laser to introduce you to the main differences between fibre laser marking machine and core components. The main difference is the working principle and the core components of the composition of the structure is different, Tianzheng laser to introduce you to the fibre laser marking machine and ultraviolet laser marking machine of the main difference.


First: the core components of the laser
Fibre laser marking machine: the use of 1064nm wavelength laser.
Ultraviolet laser marking machine: the use of 355nm ultraviolet laser, ultraviolet using 3-order cavity frequency doubling technology with infrared laser comparison, 355nm ultraviolet light focusing spot is extremely small, to a large extent, reducing the mechanical deformation of the consumables and processing thermal effects of small. On the laser wavelength, generally the shorter the wavelength, the laser out of the focus spot is smaller, the precision will be very high, the processing of the lock formation of the thermal impact of the region is smaller, the processing effect is also more fine.
Second: the advantages of fibre laser marking machine and ultraviolet laser marking machine comparison

  1. In the wavelength of each other, the wavelength of the ultraviolet laser is shorter than the wavelength of visible light (visible to the naked eye), can be more accurate focusing, in the production of extremely fine circuit characteristics at the same time, but also to maintain excellent positioning accuracy.
    2 . Processing parts temperature is relatively low, the presence of high-energy photons in the ultraviolet light on the ultraviolet laser get easy to apply large combinations of PCB circuit boards, from standard materials such as FR4 to high-frequency ceramic composites and flexible circuit board materials including polyimide are suitable for marking. Common PCB materials in the 6 different lasers under the action of the absorption rate. 6 kinds of lasers, including excimer lasers (wavelength of 248nm), infrared lasers (wavelength of 1064nm), and 2 kinds of carbon dioxide lasers (wavelengths of 9.4um and 1.06um, respectively). UV laser (ND: YAG, wavelength of 355nm) is a relatively rare three materials in the absorption rate of the same laser.
    UV laser marking machines show extremely high absorption rates when applied to resin and copper materials, and also have suitable absorption rates when processing glass. The more expensive excimer laser (wavelength 248nm) in the processing of these materials is to get a better absorption rate, the material difference makes the UV laser has become the best choice of many industrial fields of PCB material applications, from the production of the most basic circuit boards, circuit wiring, to the production of very small embedded chips and other processes are more common.